The copper wire of the PCB falls off is one of the common problems in PCB board manufacturing. Knowing the reasons for this phenomenon will help reduce the occurrence of such problems in the later period. PCB circuit board manufacturer Kingford will introduce the common causes of the copper wire of the PCB falls off in this issue.
table of Contents:
1. PCB factory process factors
2. Reasons for laminate manufacturing process
3. Reasons for laminate raw materials
1. PCB factory process factors:
1.1. Copper foil is over-etched. The electrolytic copper foils used in the market are generally single-sided galvanized (commonly known as ashing foil) and single-sided copper-plated (commonly known as red foil). Common copper foils are generally galvanized copper foil over 70um, red foil, and 18um. The copper wire of the PCB falls off in batches that have not appeared in the following ashing foils. When the circuit design is better than the etching line, if the copper foil specifications are changed without changing the etching parameters, this will cause the copper foil to stay in the etching solution for too long.
The copper wire of the PCB falls off is one of the common problems in PCB board manufacturing. Knowing the reasons for this phenomenon will help reduce the occurrence of such problems in the later period. PCB circuit board manufacturer Kingford will introduce the common causes of the copper wire of the PCB falls off in this issue.
table of Contents:
1. PCB factory process factors
2. Reasons for laminate manufacturing process
3. Reasons for laminate raw materials
1. PCB factory process factors:
1.1. Copper foil is over-etched. The electrolytic copper foils used in the market are generally single-sided galvanized (commonly known as ashing foil) and single-sided copper-plated (commonly known as red foil). Common copper foils are generally galvanized copper foil over 70um, red foil, and 18um. The copper wire of the PCB falls off in batches that have not appeared in the following ashing foils. When the circuit design is better than the etching line, if the copper foil specifications are changed without changing the etching parameters, this will cause the copper foil to stay in the etching solution for too long.
+
